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Small size (7.0*5.0mm)
SMD
Low Jitter
| Size | 7.0*5.0mm |
| Series | BS0507E |
| Supply Voltage | 1.8V，2.5V，3.3V |
| Operating Temperature | 0~70℃，-20~70℃，-30~85℃，-40~70℃，-40~85℃ |
| Output Wave | |
| TriState | Without |
| BS0507E Series | |||||||||||||
| Parameter | Value | Unit | Condtions | ||||||||||
| Supply Voltage ( VDD ) | +2.5 V ± 10% | + 3.3 V ± 10% | |||||||||||
| Available Frenquency Range | 10 ~ 250 | 10 ~ 250 | MHz | ||||||||||
| Current Consumption | 30(max) | mA | 10 ~ 50 MHz; VDD = + 3.3V | ||||||||||
| 38(max) | mA | 50 ~ 150 MHz; VDD = + 3.3V | |||||||||||
| 48(max) | mA | 150 ~ 250 MHz; VDD = + 3.3V | |||||||||||
| Output Logic " High " , " 1 " | 90 % VDD | V | |||||||||||
| Output Logic " Low " , " 0 " | 10 % VDD | V | |||||||||||
| Rise Time ( Tr ) / Fall Time ( Tf ) | 1.5 typ. | nsec | Measured between 10% ↔ 90% of wave form | ||||||||||
| 3.0 max. | nsec | ||||||||||||
| Frequency Stability over Operating Temperature Range | ±25 / ±50 / ±100 | ppm | Commercial ( -10°C to +70°C ) | ||||||||||
| ±25 / ±50 / ±100 | ppm | Industrial ( -40°C to +85°C ) | |||||||||||
| Output Load | 15 | pF | |||||||||||
| Current with Output Disable | 16 ( typ.) | mA | |||||||||||
| Duty Cycle | 50 % ± 5% | - | |||||||||||
| Start -up Time | 10 m sec. max. | ms | |||||||||||
| Storage Temperature | - 55°C~+150°C | °C | |||||||||||
| Aging | ± 2 ppm ( max.) first year ; ± 10 ppm ( max.) over 10 years | ppm | at Ta=+25°C | ||||||||||
| Output Enable / Disable Time | 200(max) | nsec | |||||||||||
| 50(max) | nsec | ||||||||||||
| OE Control on Pad 1 | 70% of VDD (min.) to enable output. (Open connection prohibit.) | - | |||||||||||
| 30% of VDD (max.) to disable output. | - | ||||||||||||
| RMS Jitter | 0.8ps typ. | ps | 12KHZ~ 20MHZ | ||||||||||
| Phase Noise [ dBc / Hz ( typ.) | Offset | 10Hz | 100Hz | 1KHz | 10KHz | 100KHz | 1MHZ | 10MHz | |||||
| 156.250 MHz | -55 | -85 | -109 | -116 | -118 | -139 | -146 | ||||||
| 622.08 MHz | -48 | -85 | -101 | -102 | -103 | -124 | -133 | ||||||
| Parameter | Condition | ||||||||||||
| Temperature Stress Test | IEC60068, GJB360B | ||||||||||||
| Mechanical Stress Test | IEC60068, GJB360B | ||||||||||||
| EMC Test (ESD) | IEC61000, JESD22 | ||||||||||||
| Solderability | EIA/JESD22-B102-C | ||||||||||||
| Contact Pads | Gold over Nickel | ||||||||||||
| RoHS | RoHS Directive 2011/65/EU Annex II Recasting 2002/95/EC | ||||||||||||
Size 7.0mm x 5.0mm, SMD, Low Jitter. Mainly used in CPU , Graphics , Multimedia A / V clocks,MPEG / DVD / HDTV clocks,Laser engine pixel / set - top clocks, SONET / SDH / ATM clocks,Fast Ethernet and Gigabit Ethernet clocks.
CPU , Graphics , Multimedia A / V clocks
MPEG / DVD / HDTV clocks
Laser engine pixel / set - top clocks
SONET / SDH / ATM clocks
Fast Ethernet and Gigabit Ethernet clocks
Example: BS0507AD3I505CN20
Disclaimer: Xtaltq Technologies Co., Limited reserves the right to make changes to the product(s) and/or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.
